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BU-67302B0C0R-202 - DDC

Description: LOW POWER MIL-STD-1553 TERMINAL WITH PCI-EXPRESS BACK-END

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BU-67302B0C0R-202 - DDC PCB footprint - BGA - BGA - BU-67302B0C0R-202
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BU-67302B0C0R-202 - DDC  - 3D model - BGA - BU-67302B0C0R-202
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BU-67302B0C0R-202 Details

  • Manufacturer Part Number:

    BU-67302B0C0R-202

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Taiwan, USA

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Data Device Corporation

  • YTEOL:

    7

  • Boundary Scan:

    YES

  • Bus Compatibility:

    PCI

  • Clock Frequency-Max:

    16 MHz

  • Communication Protocol:

    MIL STD 1553A; MIL STD 1553B; MIL STD 1760; MCAIR; STANAG-3838

  • Data Encoding/Decoding Method:

    BIPH-LEVEL (MANCHESTER)

  • Data Transfer Rate-Max:

    0.125 MBps

  • JESD-30 Code:

    R-PBGA-B233

  • Length:

    20 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of Serial I/Os:

    2

  • Number of Terminals:

    233

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA233,13X18,40

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.834 mm

  • Supply Current-Max:

    646 mA

  • Supply Voltage-Max:

    1.95 V

  • Supply Voltage-Min:

    1.65 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    15 mm

  • uPs/uCs/Peripheral ICs Type:

    SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553

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