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BU18JA2DG-CTR - ROHM Semiconductor

Description: LDO Voltage Regulators HIGH-PERFORMANCE CMOS LDO

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PCB Footprints
BU18JA2DG-CTR - ROHM Semiconductor PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - SSOP5
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3D Models
BU18JA2DG-CTR - ROHM Semiconductor  - 3D model - SOT23 (5-Pin) - SSOP5
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BU18JA2DG-CTR Details

  • Manufacturer Part Number:

    BU18JA2DG-CTR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SSOP-5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2017-03-01

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    6.8

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.315 V

  • Dropout Voltage1-Nom:

    0.16 V

  • Input Voltage Absolute-Max:

    6.5 V

  • Input Voltage-Max:

    6 V

  • Input Voltage-Min:

    3 V

  • JESD-30 Code:

    R-PDSO-G5

  • Length:

    2.9 mm

  • Line Regulation-Max:

    0.015%

  • Load Regulation-Max(%):

    0.01%

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    5

  • Operating Temperature TJ-Max:

    150 °C

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current1-Max:

    0.2 A

  • Output Voltage1-Max:

    1.836 V

  • Output Voltage1-Min:

    1.764 V

  • Output Voltage1-Nom:

    1.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR, EMBOSSED

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.25 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Voltage Tolerance-Max:

    2%

  • Width:

    1.6 mm

BU18JA2DG-CTR Frequently Asked Questions (FAQs)

  • ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure that the device is operated within the recommended temperature range (Ta=-40°C to 150°C). Use a heat sink or thermal pad to maintain a low junction temperature (Tj). Monitor the device's thermal resistance (Rth) and adjust the PCB design accordingly.
  • ROHM recommends a soldering profile with a peak temperature of 260°C, a dwell time of 10-30 seconds, and a temperature slope of 3°C/s. Refer to the ROHM soldering guide for more details.
  • Yes, the BU18JA2DG-CTR is designed to withstand vibrations up to 10G. However, ensure that the PCB is properly secured and the device is properly soldered to prevent mechanical stress.
  • Handle the device with ESD precautions, such as using an ESD wrist strap or mat. Ensure that the PCB design includes ESD protection components, such as TVS diodes or ESD arrays, to protect the device from electrostatic discharge.

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BU18JA2DG-CTR Overview

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