SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH
Packing Method:
TR
Peak Reflow Temperature (Cel):
NOT SPECIFIED
Qualification Status:
Not Qualified
Regulator Type:
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
Seated Height-Max:
0.6 mm
Surface Mount:
YES
Technology:
CMOS
Terminal Form:
FLAT
Terminal Pitch:
0.5 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
NOT SPECIFIED
Voltage Tolerance-Max:
1.4%
Width:
1.2 mm
BU18TA2WHFV-TR Frequently Asked Questions (FAQs)
ROHM recommends a thermal pad size of at least 2.5mm x 2.5mm with multiple vias to the ground plane to ensure efficient heat dissipation. A thermal resistance of 10°C/W or less is achievable with proper layout design.
To ensure SOA, monitor the device's voltage, current, and power dissipation. Use the datasheet's SOA graph to determine the maximum allowable voltage and current for a given temperature. Implement overvoltage, overcurrent, and thermal protection mechanisms to prevent damage.
Store the BU18TA2WHFV-TR in a dry, cool place with a relative humidity of 60% or less. Avoid exposing the device to temperatures above 30°C or humidity above 80% for extended periods. Use a moisture barrier bag or dry pack to store the device.
Yes, the BU18TA2WHFV-TR is suitable for high-reliability and automotive applications. ROHM provides a dedicated automotive grade version, BU18TA2WHFV-TR-A, which meets the AEC-Q101 standard. Ensure you follow the recommended design and testing guidelines for your specific application.
Handle the BU18TA2WHFV-TR with ESD-protective equipment, such as wrist straps, mats, and bags. Ensure the device is stored in an ESD-protected environment. Follow proper assembly and soldering techniques to minimize the risk of ESD damage.
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BU18TA2WHFV-TR Overview
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