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BU4051BCFV-E2 - ROHM Semiconductor

Description: High Voltage CMOS Logic ICs<Analog Switch>

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BU4051BCFV-E2 - ROHM Semiconductor - PCB symbol
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BU4051BCFV-E2 - ROHM Semiconductor PCB footprint - Small Outline Packages - Small Outline Packages - SSOP-B16
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BU4051BCFV-E2 - ROHM Semiconductor - 3D model - Small Outline Packages - SSOP-B16
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BU4051BCFV-E2 Details

  • Manufacturer Part Number:

    BU4051BCFV-E2

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Pin Count:

    16

  • Country Of Origin:

    Philippines

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    0

  • Analog IC - Other Type:

    SINGLE-ENDED MULTIPLEXER

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e2

  • Length:

    5 mm

  • Number of Channels:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Off-state Isolation-Nom:

    50 dB

  • On-state Resistance Match-Nom:

    10 Ω

  • On-state Resistance-Max (Ron):

    950 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.25 mm

  • Supply Current-Max (Isup):

    0.015 mA

  • Supply Voltage-Max (Vsup):

    18 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    550 ns

  • Switch-on Time-Max:

    550 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Copper (Sn/Cu)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    4.4 mm

BU4051BCFV-E2 Frequently Asked Questions (FAQs)

  • ROHM recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • To ensure reliable operation in high-temperature environments, it is recommended to derate the power dissipation according to the temperature derating curve provided in the datasheet. Additionally, ensure good thermal design and heat dissipation on the PCB.
  • ROHM recommends using a ceramic capacitor with a value of 1uF to 10uF, X5R or X7R dielectric, and a voltage rating of 10V or higher. The capacitor should be placed as close as possible to the VIN pin.
  • Yes, the BU4051BCFV-E2 can be used in a switching regulator application. However, it is essential to ensure that the input voltage and current ratings are not exceeded, and the device is operated within the recommended operating conditions.
  • ROHM recommends using a TVS (Transient Voltage Suppressor) diode or a Zener diode with a voltage rating of 5V or higher to protect the device from ESD. The ESD protection device should be placed as close as possible to the input pins.

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BU4051BCFV-E2 Overview

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