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BU4S01G2-TR - ROHM Semiconductor

Description: Logic Gates IC NOR SGL 2INPUT

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PCB Footprints
BU4S01G2-TR - ROHM Semiconductor PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - SSOP5
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3D Models
BU4S01G2-TR - ROHM Semiconductor  - 3D model - SOT23 (5-Pin) - SSOP5
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BU4S01G2-TR Details

  • Manufacturer Part Number:

    BU4S01G2-TR

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SSOP

  • Package Description:

    ROHS COMPLIANT, SSOP-5

  • Pin Count:

    5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    0

  • Family:

    4000/14000/40000

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    NOR GATE

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Inputs:

    2

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Schmitt Trigger:

    NO

  • Seated Height-Max:

    1.25 mm

  • Supply Voltage-Max (Vsup):

    16 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Width:

    1.6 mm

BU4S01G2-TR Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure that the device is operated within the recommended temperature range (−40°C to +150°C). Use a heat sink or thermal interface material to reduce thermal resistance. Monitor the junction temperature to prevent overheating.
  • The maximum allowable voltage on the input pins is 6V. Exceeding this voltage may cause damage to the device.
  • Yes, the BU4S01G2-TR is AEC-Q100 qualified and suitable for high-reliability and automotive applications. However, additional testing and validation may be required for specific use cases.
  • The BU4S01G2-TR has built-in ESD protection, but additional external protection measures such as TVS diodes or ESD arrays may be necessary depending on the application and environment.

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