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BU508AF - NXP

Description: Power Bipolar Transistor, 8A I(C), 700V V(BR)CEO, 1-Element, NPN, Silicon, Plastic/Epoxy, 3 Pin

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PCB Footprints
BU508AF - NXP PCB footprint - Other - Other - SOT199-1
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3D Models
BU508AF - NXP  - 3D model - Other - SOT199-1
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BU508AF Details

  • Manufacturer Part Number:

    BU508AF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SFM

  • Package Description:

    PLASTIC, SOT-199, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT199

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Additional Feature:

    FORMED LEAD OPTIONS ARE AVAILABLE

  • Case Connection:

    ISOLATED

  • Collector Current-Max (IC):

    8 A

  • Collector-Emitter Voltage-Max:

    700 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    6

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    NPN

  • Power Dissipation Ambient-Max:

    34 W

  • Power Dissipation-Max (Abs):

    34 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    TIN

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    7 MHz

  • VCEsat-Max:

    1 V

BU508AF Frequently Asked Questions (FAQs)

  • The maximum safe operating area (SOA) for the BU508AF is not explicitly stated in the datasheet, but it can be determined by consulting the NXP application note AN11184, which provides guidelines for calculating the SOA for power MOSFETs like the BU508AF.
  • To ensure proper thermal management, it's essential to follow the thermal design guidelines provided in the datasheet and application notes. This includes selecting a suitable heat sink, applying a thermal interface material, and ensuring good airflow around the device. Additionally, the thermal resistance of the package (Rth(j-a)) should be considered when designing the thermal management system.
  • The recommended gate drive voltage for the BU508AF is typically between 10V to 15V, depending on the specific application and switching frequency. However, it's essential to consult the datasheet and application notes for specific guidance on gate drive voltage and switching frequency to ensure optimal performance and reliability.
  • To handle the high peak current capability of the BU508AF during switching transients, it's essential to ensure that the PCB layout is designed to minimize inductance and resistance in the power loop. Additionally, the use of a suitable snubber circuit or RC filter can help to reduce voltage overshoot and ringing during switching transients.
  • The BU508AF's high dv/dt rating requires careful system design to ensure that the device is not subjected to excessive voltage stress during switching transients. This includes ensuring that the system is designed to handle high-frequency switching, and that the layout and component selection are optimized to minimize voltage overshoot and ringing.

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BU508AF Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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Part Image BU508AFI Unisonic Technologies Co Ltd

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Part Image BU508AF Baneasa SA

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Part Image BU508AF SANYO Electric Co Ltd

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Part Image BU508AFTBTU Fairchild Semiconductor Corporation

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Part Image BU508AF Fairchild Semiconductor Corporation

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For a full list of alternate parts for BU508AF, check out Findchips.com