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BU7242SFVM-TR - ROHM Semiconductor

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BU7242SFVM-TR Details

  • Manufacturer Part Number:

    BU7242SFVM-TR

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    6.2

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Common-mode Reject Ratio-Min:

    45 dB

  • Common-mode Reject Ratio-Nom:

    60 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    10000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Equivalence Code:

    TSSOP8,.16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.9 mm

  • Slew Rate-Nom:

    0.4 V/us

  • Supply Current-Max:

    0.6 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Unity Gain BW-Nom:

    900

  • Voltage Gain-Min:

    3160

  • Wideband:

    NO

  • Width:

    2.8 mm

BU7242SFVM-TR Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to have a large copper area on the bottom layer connected to the thermal pad, and to use thermal vias to dissipate heat. A minimum of 2oz copper thickness is recommended.
  • To ensure reliable operation at high temperatures, it is recommended to follow the recommended operating conditions, use a heat sink if necessary, and ensure good airflow around the device. Additionally, consider using a thermal interface material to improve heat transfer between the device and heat sink.
  • The maximum allowable voltage on the input pins is the absolute maximum rating of 7V, exceeding which may cause damage to the device. It is recommended to keep the input voltage within the recommended operating range of 2.7V to 5.5V.
  • To handle ESD protection for this device, it is recommended to follow proper ESD handling procedures during assembly and storage, and to use ESD protection devices such as TVS diodes or ESD arrays on the input lines.
  • The recommended power-up sequence for this device is to power up the input voltage (VIN) before the enable pin (EN). This ensures that the device is properly initialized and configured before operation.

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BU7242SFVM-TR Overview

Use the download button to access the BU7242SFVM-TR 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like BU724, or try a keyword search, such as Operational Amplifiers

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Part Image BU7242SFVM ROHM Semiconductor

Operational Amplifier, 2 Func, 10000uV Offset-Max, CMOS, PDSO8