ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
Ensure that the device is operated within the recommended temperature range (Ta=-40°C to 125°C). Use a heat sink or thermal pad to keep the junction temperature (Tj) below 150°C. Monitor the device's thermal resistance (Rth) and adjust the PCB design accordingly.
The maximum allowed voltage on the input pins is VCC + 0.3V, but it's recommended to keep it within VCC + 0.1V to ensure reliable operation and prevent latch-up.
ROHM recommends using ESD protection devices, such as TVS diodes or ESD arrays, on the input lines to protect the BU7253SF-E2 from electrostatic discharge. Follow the IEC 61000-4-2 standard for ESD testing and protection.
ROHM recommends powering up the VCC pin first, followed by the input signals. This ensures that the internal voltage regulators are stable before the input signals are applied.
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BU7253SF-E2 Overview
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