ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
To ensure stable operation with a high-impedance input source, ROHM recommends adding a 1kΩ to 10kΩ resistor in series with the input pin to reduce the input impedance and prevent oscillation.
Although the datasheet doesn't specify a maximum voltage for the EN pin, ROHM recommends keeping it within the VCC range (i.e., 2.5V to 5.5V) to ensure proper operation and prevent damage to the device.
While the BU7262F-E2 is rated for operation up to 105°C, ROHM recommends derating the output current and power dissipation to ensure reliable operation in high-temperature environments. Consult ROHM's application notes for specific guidance.
To minimize EMI, ROHM recommends using a shielded layout, keeping the switching node (SW pin) as short as possible, and using a common-mode choke or ferrite bead on the output lines. Additionally, ensure that the PCB layout follows good EMI design practices.
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BU7262F-E2 Overview
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