ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a dedicated heat sink.
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Additionally, consider using a heat sink or thermal management system to keep the device temperature within the recommended range.
ROHM recommends using a ceramic capacitor with a value of 10uF to 22uF, and an X7R or X5R dielectric, as close to the VIN pin as possible. This helps to filter out noise and ensure stable operation.
Check the input voltage, ensure it's within the recommended range, and verify that the enable pin (EN) is properly connected and biased. Also, check for any short circuits or incorrect connections on the output pins. If the issue persists, consult the application notes and evaluation board schematics for guidance.
The maximum output current capability of the BU7262FVM-TR is 2A. However, the actual output current may be limited by the input voltage, output voltage, and thermal conditions. Be sure to check the datasheet and application notes for specific guidance on output current capability.
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BU7262FVM-TR Overview
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