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BU7262SFVM-TR - ROHM Semiconductor

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BU7262SFVM-TR - ROHM Semiconductor  - 3D model
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BU7262SFVM-TR Details

  • Manufacturer Part Number:

    BU7262SFVM-TR

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    6.22

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Common-mode Reject Ratio-Nom:

    60 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    10000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Equivalence Code:

    TSSOP8,.16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TAPE AND REEL

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.9 mm

  • Slew Rate-Nom:

    1.1 V/us

  • Supply Current-Max:

    1.2 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Unity Gain BW-Nom:

    2000

  • Voltage Gain-Min:

    3160

  • Width:

    2.8 mm

BU7262SFVM-TR Frequently Asked Questions (FAQs)

  • ROHM recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, use a suitable heat sink, and implement thermal management techniques such as thermal interface materials and airflow management.
  • Although the datasheet specifies the recommended operating voltage range, it's essential to note that the maximum allowed voltage on the input pins is 6V to prevent damage to the device.
  • Yes, the BU7262SFVM-TR is suitable for high-frequency switching applications up to 1MHz. However, it's crucial to follow the recommended layout and decoupling guidelines to minimize EMI and ensure reliable operation.
  • To prevent ESD damage, it's essential to follow standard ESD handling and assembly procedures, such as using ESD-safe workstations, wrist straps, and packaging materials. Additionally, consider implementing ESD protection devices on the PCB.

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BU7262SFVM-TR Overview

Use the download button to access the BU7262SFVM-TR 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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