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BU7262SNUX-TR - ROHM Semiconductor

Description: Operational Amplifiers - Op Amps OP Amp Dual GP 5.5V +/-2.75V

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PCB Footprints
BU7262SNUX-TR - ROHM Semiconductor PCB footprint - Small Outline No-lead - Small Outline No-lead - VSON008X2030-1
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3D Models
BU7262SNUX-TR - ROHM Semiconductor  - 3D model - Small Outline No-lead - VSON008X2030-1
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BU7262SNUX-TR Details

  • Manufacturer Part Number:

    BU7262SNUX-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SON

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    6.55

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Common-mode Reject Ratio-Nom:

    60 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    10000 µV

  • JESD-30 Code:

    R-PDSO-N8

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.11,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TAPE AND REEL

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.6 mm

  • Slew Rate-Nom:

    1.1 V/us

  • Supply Current-Max:

    1.2 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Unity Gain BW-Nom:

    2000

  • Voltage Gain-Min:

    3160

  • Width:

    2 mm

BU7262SNUX-TR Frequently Asked Questions (FAQs)

  • ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a dedicated heat sink.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Additionally, consider using a heat sink or thermal management system to keep the device temperature within the recommended range.
  • ROHM recommends using a ceramic capacitor with a value of 10uF to 22uF, and an X5R or X7R dielectric, as close to the VIN pin as possible. This helps to filter out noise and ensure stable operation.
  • Check the input voltage, ensure it's within the recommended range, and verify that the enable pin (EN) is properly connected and driven. Also, check for any short circuits or incorrect connections on the output pins. If the issue persists, consult the application notes and contact ROHM support for further assistance.
  • The maximum output current capability of the BU7262SNUX-TR is 2A. However, it's essential to consider the thermal performance and ensure that the device is operated within the recommended temperature range to maintain reliability and prevent overheating.

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