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BU7444SF-E2 - ROHM Semiconductor

Description: Low Power Ground Sense Operational Amplifier

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BU7444SF-E2 - ROHM Semiconductor  - 3D model
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BU7444SF-E2 Details

  • Manufacturer Part Number:

    BU7444SF-E2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    14

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    6.22

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Common-mode Reject Ratio-Nom:

    60 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    6000 µV

  • JESD-30 Code:

    R-PDSO-G14

  • Length:

    8.7 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TAPE AND REEL

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.71 mm

  • Slew Rate-Nom:

    0.3 V/us

  • Supply Current-Max:

    0.96 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Unity Gain BW-Nom:

    600

  • Voltage Gain-Min:

    3160

  • Width:

    4.4 mm

BU7444SF-E2 Frequently Asked Questions (FAQs)

  • ROHM recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • To ensure reliable operation in high-temperature environments, it is recommended to derate the device's power dissipation according to the temperature derating curve provided in the datasheet. Additionally, ensure good thermal design and heat dissipation on the PCB.
  • ROHM recommends using a low-ESR ceramic capacitor with a value of 10uF to 22uF for the input capacitor. This helps to reduce voltage ripple and ensure stable operation.
  • To troubleshoot OCP issues, check the input voltage, output current, and sense resistor values. Ensure that the sense resistor is correctly connected and that the OCP threshold is set correctly. Also, verify that the device is not overheating, which can trigger the OCP feature.
  • ROHM recommends using a low-ESR ceramic capacitor with a value of 10uF to 47uF for the output capacitor. This helps to reduce output voltage ripple and ensure stable operation.

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BU7444SF-E2 Overview

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