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BU7461G-TR - ROHM Semiconductor

Description: ROHM BU7461G-TR Op Amp, 1MHz CMOS, 3 V, 5 V, 5-Pin SSOP

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PCB Footprints
BU7461G-TR - ROHM Semiconductor PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - SSOP5
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3D Models
BU7461G-TR - ROHM Semiconductor  - 3D model - SOT23 (5-Pin) - SSOP5
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BU7461G-TR Details

  • Manufacturer Part Number:

    BU7461G-TR

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SSOP

  • Pin Count:

    5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    6.28

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Common-mode Reject Ratio-Nom:

    60 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    6000 µV

  • JESD-30 Code:

    R-PDSO-G5

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TAPE AND REEL

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.25 mm

  • Slew Rate-Nom:

    1 V/us

  • Supply Current-Max:

    0.45 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Unity Gain BW-Nom:

    1000

  • Voltage Gain-Min:

    3160

  • Wideband:

    NO

  • Width:

    1.6 mm

BU7461G-TR Frequently Asked Questions (FAQs)

  • ROHM recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • To ensure reliable operation in high-temperature environments, it is recommended to derate the device's power dissipation according to the temperature derating curve provided in the datasheet. Additionally, ensure good thermal design and heat sinking to keep the junction temperature below 150°C.
  • ROHM recommends using a low-ESR ceramic capacitor with a value of 10uF to 22uF for the input capacitor. The capacitor should be placed as close to the VIN pin as possible to minimize noise and ensure stable operation.
  • To troubleshoot issues with the device's output voltage regulation, check the input voltage, output load, and feedback resistors for correct values and connections. Also, ensure that the device is operating within its specified temperature range and that the output capacitor is of sufficient value and type.
  • The maximum allowable voltage on the EN pin is 6V. Exceeding this voltage may damage the device. It is recommended to use a voltage limiter or a resistor divider network to ensure the EN pin voltage remains within the specified range.

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