BU9873FVM-GTTR - ROHM Semiconductor

BU9873FVM-GTTR Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  ROHM recommends a thermal pad design with a minimum size of 2.5mm x 2.5mm, and a thermal via array with a minimum of 10 vias, 0.3mm in diameter, and 1.5mm deep to ensure optimal heat dissipation.
• How do I ensure the device operates within the safe operating area (SOA)?
  To ensure SOA, monitor the device's voltage, current, and temperature. Use the datasheet's SOA graph to determine the maximum allowed voltage and current for a given temperature. Implement over-voltage, over-current, and over-temperature protection circuits as needed.
• What is the recommended input capacitor value and type for the BU9873FVM-GTTR?
  ROHM recommends a 10uF to 22uF ceramic capacitor (X5R or X7R type) with a voltage rating of 25V or higher, placed as close as possible to the VIN pin to ensure stable input voltage and reduce noise.
• How do I minimize electromagnetic interference (EMI) in my design?
  To minimize EMI, use a shielded layout, keep the switching node (SW pin) as short as possible, and use a common-mode choke or ferrite bead on the output lines. Additionally, ensure the PCB has a solid ground plane and use EMI-absorbing materials if necessary.
• What is the maximum allowed junction temperature (Tj) for the BU9873FVM-GTTR?
  The maximum allowed Tj is 150°C. Exceeding this temperature may reduce the device's lifespan or cause permanent damage. Ensure proper thermal design and cooling to keep the junction temperature within the recommended range.