SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
Packing Method:
TR
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Seated Height-Max:
1.2 mm
Slew Rate-Nom:
1.6 V/us
Supply Current-Max:
7.5 mA
Supply Voltage Limit-Max:
19 V
Supply Voltage-Nom (Vsup):
18 V
Surface Mount:
YES
Technology:
BIPOLAR
Temperature Grade:
OTHER
Terminal Finish:
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form:
GULL WING
Terminal Pitch:
0.65 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Width:
4.4 mm
BUF07704AIPWPR Frequently Asked Questions (FAQs)
Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good layout practices, such as keeping the input and output traces short and separate, using a solid ground plane, and placing decoupling capacitors close to the device.
The output capacitor value depends on the specific application and desired performance. A general rule of thumb is to use a capacitor with a value between 1uF to 10uF, with a voltage rating that exceeds the maximum output voltage. TI also provides a capacitor selection guide in the datasheet.
The maximum power dissipation of the BUF07704AIPWPR is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C ambient temperature. However, it's essential to calculate the power dissipation based on the specific application and thermal environment.
While the BUF07704AIPWPR can be used as a voltage regulator, it's not recommended as it's primarily designed as a buffer amplifier. The device is not optimized for voltage regulation, and its performance may not meet the requirements of a dedicated voltage regulator.
To ensure stability and prevent oscillations, follow the recommended layout and decoupling guidelines, use a suitable output capacitor, and avoid high-gain configurations. Additionally, TI provides a stability analysis tool and application notes to help designers optimize their designs.
Trust Checks
This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
BUF07704AIPWPR Overview
Use the download button to access the BUF07704AIPWPR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like BUF07,
or try a keyword search, such as Buffer Amplifiers
About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
