SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Seated Height-Max:
1.2 mm
Supply Voltage-Max (Vsup):
20 V
Supply Voltage-Min (Vsup):
9 V
Supply Voltage-Nom (Vsup):
18 V
Surface Mount:
YES
Technology:
CMOS
Temperature Grade:
INDUSTRIAL
Terminal Finish:
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form:
GULL WING
Terminal Pitch:
0.5 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Width:
4.4 mm
BUF22821AIDCPR Frequently Asked Questions (FAQs)
A good PCB layout is crucial for the BUF22821AIDCPR. TI recommends a 4-layer PCB with a solid ground plane, and the use of vias to connect the top and bottom layers. Keep the input and output traces short and symmetrical, and avoid routing signals under the device.
The output capacitor (COUT) should be chosen based on the desired output voltage ripple, output current, and stability requirements. A general rule of thumb is to use a capacitor with a value between 10uF to 22uF, and an ESR of less than 100mΩ. TI recommends using a low-ESR ceramic capacitor, such as the X5R or X7R type.
The BUF22821AIDCPR can handle input voltages up to 18V, but it's recommended to keep the input voltage below 15V to ensure reliable operation and minimize power dissipation.
To ensure stability, follow the recommended PCB layout, use a suitable output capacitor, and ensure that the input and output traces are properly decoupled. Additionally, TI recommends adding a 10nF to 22nF capacitor between the VIN and GND pins to filter out high-frequency noise.
The typical startup time for the BUF22821AIDCPR is around 1ms to 2ms, depending on the input voltage and output load. This can be affected by the output capacitor value, input voltage, and output current.
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BUF22821AIDCPR Overview
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About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
