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BUF634T - Texas Instruments

Description: 250-mA high-speed buffer - see BUF634A for upgraded version

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Symbol
BUF634T - Texas Instruments - PCB symbol
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PCB Footprints
BUF634T - Texas Instruments PCB footprint - Other - Other - KC0005A_2
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3D Models
BUF634T - Texas Instruments - 3D model - Other - KC0005A_2
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BUF634T Details

  • Manufacturer Part Number:

    BUF634T

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    SFM

  • Pin Count:

    3

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    1993-07-01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    1

  • Amplifier Type:

    BUFFER

  • Average Bias Current-Max (IIB):

    20 µA

  • Bandwidth (3dB)-Nom:

    180 MHz

  • Bias Current-Max (IIB) @25C:

    20 µA

  • Input Offset Voltage-Max:

    100000 µV

  • JESD-30 Code:

    R-PSFM-T5

  • JESD-609 Code:

    e3

  • Length:

    10.16 mm

  • Neg Supply Voltage Limit-Max:

    -18 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SFM

  • Package Equivalence Code:

    SIP5,.1,67TB

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Packing Method:

    TUBE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    16.51 mm

  • Slew Rate-Nom:

    2000 V/us

  • Supply Current-Max:

    20 mA

  • Supply Voltage Limit-Max:

    18 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    NO

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    1.7 mm

  • Terminal Position:

    SINGLE

  • Unity Gain BW-Nom:

    180000

  • Width:

    4.445 mm

BUF634T Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the BUF634T is dependent on the thermal resistance of the package and the ambient temperature. According to the datasheet, the maximum power dissipation is approximately 2.5W at 25°C ambient temperature.
  • To ensure stability when using the BUF634T as a unity-gain buffer, it's recommended to add a capacitor (typically 10nF to 100nF) between the output and the inverting input to prevent oscillations. Additionally, the layout should be designed to minimize parasitic inductance and capacitance.
  • The recommended operating voltage range for the BUF634T is 5V to 15V, although the device can operate up to 18V. However, operating the device at higher voltages may reduce its reliability and lifespan.
  • The BUF634T has internal ESD protection, but it's still recommended to follow proper ESD handling procedures when handling the device. This includes using an ESD wrist strap or mat, and storing the device in an anti-static bag or container.
  • While the BUF634T is typically used as a unity-gain buffer, it can be used as a voltage follower with a gain greater than 1. However, this requires careful consideration of the device's bandwidth, slew rate, and stability. It's recommended to consult the datasheet and application notes for guidance on designing a non-unity gain voltage follower.

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BUF634T Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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