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BUK6607-75C,118 - Nexperia

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BUK6607-75C,118 Details

  • Manufacturer Part Number:

    BUK6607-75C,118

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    D2PAK

  • Package Description:

    D2PAK-3/2

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT404

  • ECCN Code:

    EAR99

  • Manufacturer:

    Nexperia

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    191 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    75 V

  • Drain Current-Max (ID):

    100 A

  • Drain-source On Resistance-Max:

    0.0097 Ω

  • FET Technology:

    TRENCH MOSFET

  • Feedback Cap-Max (Crss):

    410 pF

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    245

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    204 W

  • Pulsed Drain Current-Max (IDM):

    423 A

  • Reference Standard:

    AEC-Q101; IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

BUK6607-75C,118 Frequently Asked Questions (FAQs)

  • Nexperia recommends a PCB layout with a thermal pad connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a heat sink.
  • To ensure proper biasing, the gate-source voltage (Vgs) should be within the recommended range (typically 10-15V) and the drain-source voltage (Vds) should be within the maximum rating (75V for BUK6607-75C,118). Additionally, a gate resistor (Rg) should be used to limit the gate current and prevent oscillations.
  • The maximum allowed power dissipation for BUK6607-75C,118 is dependent on the ambient temperature and the thermal resistance of the device. According to the datasheet, the maximum power dissipation is 150W at 25°C ambient temperature, but this value decreases as the temperature increases. It's essential to calculate the power dissipation based on the specific application and thermal conditions.
  • Yes, the BUK6607-75C,118 is suitable for high-frequency switching applications due to its low gate charge and internal gate resistance. However, it's essential to consider the device's switching characteristics, such as the rise and fall times, and ensure that the application's switching frequency is within the device's capabilities.
  • To protect the device from overvoltage and overcurrent conditions, it's recommended to use a voltage clamp or a transient voltage suppressor (TVS) to limit the voltage across the device. Additionally, a current sense resistor and a fuse or a current limiter can be used to detect and prevent overcurrent conditions.

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BUK6607-75C,118 Overview

Use the download button to access the BUK6607-75C,118 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like BUK66, or try a keyword search, such as Power Field-Effect Transistors

About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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