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BUK7K17-60EX - Nexperia

Description: MOSFET 60V N-CHANNEL STD LEVEL DUAL

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PCB Footprints
BUK7K17-60EX - Nexperia PCB footprint - Other - Other - LFPAK56D (SOT1205)_2021
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BUK7K17-60EX - Nexperia  - 3D model - Other - LFPAK56D (SOT1205)_2021
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BUK7K17-60EX Details

  • Manufacturer Part Number:

    BUK7K17-60EX

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8, 4 PIN

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOT1205

  • Country Of Origin:

    Mainland China, Philippines

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    5

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    55 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    30 A

  • Drain-source On Resistance-Max:

    0.014 Ω

  • FET Technology:

    TRENCH MOSFET

  • Feedback Cap-Max (Crss):

    158 pF

  • JESD-30 Code:

    R-PSSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    53 W

  • Pulsed Drain Current-Max (IDM):

    164 A

  • Reference Standard:

    AEC-Q101; IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

BUK7K17-60EX Frequently Asked Questions (FAQs)

  • The SOA is not explicitly stated in the datasheet, but it can be estimated based on the device's thermal resistance, maximum junction temperature, and voltage ratings. Consult Nexperia's application notes for guidance on SOA calculations.
  • To minimize switching losses, ensure the gate drive voltage is sufficient (typically 10-15V) and the gate resistance is minimized (e.g., using a low-ESR capacitor). Also, consider using a gate driver IC to provide a high-current, fast-rise-time signal.
  • To minimize parasitic inductance and capacitance, use a compact, symmetrical PCB layout with short, wide traces. Place the device close to the power source and use a solid ground plane. Avoid using vias or narrow traces near the device.
  • Ensure good thermal contact between the device and a heat sink or thermal pad. Use a thermal interface material (TIM) to fill gaps and reduce thermal resistance. Consider using a fan or other cooling system for high-power applications.
  • The BUK7K17-60EX has an internal ESD protection diode, but it's still important to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure the device is stored in an anti-static package.

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BUK7K17-60EX Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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