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BUK9840-55,115 - Nexperia

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BUK9840-55,115 Details

  • Manufacturer Part Number:

    BUK9840-55,115

  • Brand Name:

    Nexperia

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SC-73

  • Package Description:

    SMALL OUTLINE, R-PDSO-G4

  • Pin Count:

    4

  • Manufacturer Package Code:

    SOT223

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.75

  • Manufacturer:

    Nexperia

  • YTEOL:

    0

  • Additional Feature:

    LOGIC LEVEL COMPATIBLE, ESD PROTECTED

  • Avalanche Energy Rating (Eas):

    60 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    55 V

  • Drain Current-Max (ID):

    5 A

  • Drain-source On Resistance-Max:

    0.04 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    150 pF

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation Ambient-Max:

    1.8 W

  • Power Dissipation-Max (Abs):

    8.3 W

  • Pulsed Drain Current-Max (IDM):

    40 A

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    AEC-Q101; IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    210 ns

  • Turn-on Time-Max (ton):

    125 ns

BUK9840-55,115 Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout in the application note AN11160, which includes guidelines for thermal pad connection, copper thickness, and via placement to ensure optimal thermal performance.
  • Power dissipation can be calculated using the formula Pd = (Vds x Ids) + (Vgs x Igs), where Vds is the drain-source voltage, Ids is the drain-source current, Vgs is the gate-source voltage, and Igs is the gate-source current. Refer to the datasheet for the maximum allowed power dissipation.
  • The maximum allowed junction temperature for the BUK9840-55,115 is 175°C, as specified in the datasheet. Exceeding this temperature may lead to device failure or reduced lifespan.
  • Yes, the BUK9840-55,115 is qualified for automotive and high-reliability applications. It meets the requirements of the AEC-Q101 standard and is suitable for use in harsh environments.
  • To ensure EMC, follow the guidelines in the NXP application note AN11069, which provides recommendations for PCB layout, component selection, and shielding to minimize electromagnetic interference.

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BUK9840-55,115 Overview

Use the download button to access the BUK9840-55,115 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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