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BUK9y4R8-60e - Nexperia

Description: NXP - BUK9Y4R8-60E - MOSFET, N-CH, 60V, 100A, LFPAK

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PCB Footprints
BUK9y4R8-60e - Nexperia PCB footprint - Other - Other -  LFPAK56; Power-SO8 (SOT669)
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BUK9y4R8-60e - Nexperia  - 3D model - Other -  LFPAK56; Power-SO8 (SOT669)
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BUK9y4R8-60e Details

  • Manufacturer Part Number:

    BUK9Y4R8-60E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOT-669, 4 PIN

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Date Of Intro:

    2017-02-01

  • Manufacturer:

    Nexperia

  • YTEOL:

    5.6

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    199 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    100 A

  • Drain-source On Resistance-Max:

    0.0048 Ω

  • FET Technology:

    TRENCH MOSFET

  • Feedback Cap-Max (Crss):

    378 pF

  • JEDEC-95 Code:

    MO-235

  • JESD-30 Code:

    R-PSSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    238 W

  • Pulsed Drain Current-Max (IDM):

    593 A

  • Reference Standard:

    AEC-Q101; IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

BUK9y4R8-60e Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the BUK9Y4R8-60E is -55°C to 175°C.
  • To ensure safe operating area (SOA), follow the guidelines in the datasheet, considering factors like voltage, current, and temperature. Additionally, use a thermal model to simulate the device's behavior under various operating conditions.
  • For optimal thermal performance, use a PCB layout with a large copper area for heat dissipation, and consider using thermal vias to connect the top and bottom layers. Follow Nexperia's application notes and thermal design guidelines for more information.
  • Yes, the BUK9Y4R8-60E is suitable for high-frequency switching applications due to its low gate charge, low RDS(on), and fast switching times. However, ensure that the PCB layout and design are optimized for high-frequency operation to minimize parasitic inductances and capacitances.
  • Choose a gate driver that can provide a sufficient gate current and voltage to ensure fast and reliable switching. Consider factors like the driver's output current, voltage, and rise/fall times, as well as the device's gate charge and threshold voltage.

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BUK9y4R8-60e Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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