ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
Ensure proper thermal management, follow the recommended PCB layout, and consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink. Also, consider using a heat sink with a thermal resistance of 10°C/W or lower.
Handle the device by the body, avoiding touching the leads or pins. Store the device in a dry, cool place, away from direct sunlight and moisture. Use anti-static packaging and follow ESD precautions during handling and assembly.
Yes, the BV1LB085FJ-CE2 is AEC-Q101 qualified, making it suitable for automotive and high-reliability applications. However, ensure you follow the recommended operating conditions, and consult with ROHM's technical support for specific application guidance.
ROHM recommends soldering at a peak temperature of 260°C (500°F) for 10 seconds or less, using a solder with a melting point above 217°C (423°F). Ensure the device is not exposed to temperatures above 260°C (500°F) during soldering.
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BV1LB085FJ-CE2 Overview
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