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BY550-100 - Diotec

Description: Rectifiers Diode, D5.4x7.5, 100V, 5A

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PCB Footprints
BY550-100 - Diotec PCB footprint - Diodes, Axial Diameter Horizontal Mounting - Diodes, Axial Diameter Horizontal Mounting - DO-201_20233
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3D Models
BY550-100 - Diotec  - 3D model - Diodes, Axial Diameter Horizontal Mounting - DO-201_20233
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BY550-100 Details

  • Manufacturer Part Number:

    BY550-100

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Diotec Semiconductor AG

  • YTEOL:

    5.95

  • Application:

    GENERAL PURPOSE

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.1 V

  • JESD-30 Code:

    O-PALF-W2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    335 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Output Current-Max:

    5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    ROUND

  • Package Style:

    LONG FORM

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    WIRE

  • Terminal Position:

    AXIAL

  • Time@Peak Reflow Temperature-Max (s):

    10

BY550-100 Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to use a large copper area on the bottom side of the PCB as a heat sink, connected to the tab of the BY550-100. Additionally, using thermal vias to dissipate heat to the top side of the PCB can also improve thermal performance.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended derating curves for the BY550-100. Additionally, ensuring good thermal design, using a heat sink, and providing adequate airflow can help to reduce the junction temperature and ensure reliable operation.
  • The recommended soldering conditions for the BY550-100 are a peak temperature of 260°C, with a soldering time of 10 seconds or less. It's also recommended to use a solder with a melting point of 220°C or higher.
  • Yes, the BY550-100 can be used in switching applications, but it's essential to ensure that the switching frequency is within the recommended range, and that the device is properly biased to prevent oscillation. Additionally, using a snubber circuit can help to reduce electromagnetic interference (EMI).
  • To protect the BY550-100 from overvoltage and overcurrent, it's recommended to use a voltage regulator or a zener diode to limit the voltage, and a current limiter or a fuse to limit the current. Additionally, using a TVS (transient voltage suppressor) diode can help to protect the device from voltage transients.

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BY550-100 Overview

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