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BYG20J - Diotec

Description: Rectifiers Ultrafast, SMA, 600V, 1.5A, 150C

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Symbol
BYG20J - Diotec - PCB symbol
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PCB Footprints
BYG20J - Diotec PCB footprint - Diodes Moulded - Diodes Moulded - DO-214AC*
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3D Models
BYG20J - Diotec - 3D model - Diodes Moulded - DO-214AC*
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BYG20J Details

  • Manufacturer Part Number:

    BYG20J

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Date Of Intro:

    2020-04-07

  • Manufacturer:

    Diotec Semiconductor AG

  • YTEOL:

    7

  • Additional Feature:

    SNUBBER DIODE

  • Application:

    ULTRA FAST RECOVERY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.4 V

  • JEDEC-95 Code:

    DO-214AC

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -50 °C

  • Output Current-Max:

    1.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    1 µA

  • Reverse Recovery Time-Max:

    0.075 µs

  • Reverse Test Voltage:

    600 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

BYG20J Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to use a large copper area on the top and bottom layers, connected to the thermal pad of the BYG20J, and to use thermal vias to dissipate heat efficiently.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Use a reflow oven or a hot air gun to solder the component, and avoid applying excessive pressure or vibration during the process.
  • Although the datasheet doesn't specify a maximum allowed voltage transient, as a general rule, it's recommended to limit voltage transients to 10% to 20% of the maximum rated voltage to ensure the device's reliability and prevent damage.
  • Yes, the BYG20J can be used in high-frequency switching applications, but it's essential to consider the device's switching characteristics, such as the turn-on and turn-off times, and to ensure that the PCB layout is optimized for high-frequency operation.
  • To protect the BYG20J from ESD, handle the device with an anti-static wrist strap or mat, and ensure that the PCB and assembly process are ESD-safe. Additionally, consider adding ESD protection components, such as TVS diodes, to the circuit.

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BYG20J Overview

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