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BYQ28X-200 - NXP

Description: Diode Array 1 Pair Common Cathode 200 V 10A Through Hole TO-220-3 Full Pack, Isolated Tab

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Symbol
BYQ28X-200 - NXP - PCB symbol
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PCB Footprints
BYQ28X-200 - NXP PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220F (SOT186A)
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3D Models
BYQ28X-200 - NXP - 3D model - Transistor Outline, Vertical - TO-220F (SOT186A)
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BYQ28X-200 Details

  • Manufacturer Part Number:

    BYQ28X-200

  • Source Url Status Check Date:

    2013-06-14 00:00:00

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Part Package Code:

    TO-220AB

  • Package Description:

    PLASTIC, TO-220F, FULL PACK-3

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    NXP Semiconductors

  • Application:

    ULTRA FAST RECOVERY

  • Case Connection:

    ISOLATED

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.895 V

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    55 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    10 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    200 V

  • Reverse Recovery Time-Max:

    0.025 µs

  • Surface Mount:

    NO

  • Terminal Finish:

    TIN

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

BYQ28X-200 Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout in the application note AN11160, which includes guidelines for thermal vias, copper thickness, and component placement to ensure optimal thermal performance.
  • To ensure reliable operation in high-temperature environments, follow the guidelines in the datasheet for derating the device, use a suitable thermal interface material, and consider using a heat sink or thermal management system.
  • NXP recommends following the soldering conditions outlined in the application note AN10365, which includes guidelines for temperature, time, and soldering techniques to ensure reliable assembly.
  • While the BYQ28X-200 is designed for isolated topologies, it can be used in non-isolated topologies with proper design considerations. However, this may require additional components and design expertise to ensure safe and reliable operation.
  • NXP provides troubleshooting guidelines in the application note AN11159, which includes steps to identify and resolve common issues, as well as recommendations for debugging and fault analysis.

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BYQ28X-200 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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Part Image BYQ28X-200,127 NXP Semiconductors

Rectifier Diode, 1 Phase, 2 Element, 10A, 200V V(RRM), Silicon, TO-220AB