- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for BYV26E
- Part Number BYV26E
- Manufacturer EIC Semiconductor
- Pin Count 2
- Part Category Diode
- Package Category Diodes, Axial Diameter Horizontal Mounting
- Footprint Name Diodes, Axial Diameter Horizontal Mounting - DO - 41-----
- Released Date Mar 8, 2020
- Last Modified Date Mar 7, 2023 4:10 PM UTC
- Pinout / Pin List Click Here (Member Only)
BYV26E Details
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Manufacturer Part Number:
BYV26E
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Reach Compliance Code:
Compliant
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Country Of Origin:
Thailand
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ECCN Code:
EAR99
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HTS Code:
8541.10.00.80
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Manufacturer:
EIC Semiconductor Inc
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YTEOL:
6
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Application:
GENERAL PURPOSE
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Configuration:
SINGLE
BYV26E Frequently Asked Questions (FAQs)
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A good PCB layout for the BYV26E should prioritize thermal dissipation. Place the device near a thermal pad or a heat sink, and ensure good copper coverage around the device. Avoid routing high-current traces near the device, and use thermal vias to dissipate heat efficiently.
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To ensure reliable operation at high temperatures, follow the recommended operating conditions, and consider derating the device's power dissipation. Implement a thermal management system, such as a heat sink or fan, to keep the junction temperature below 150°C. Monitor the device's temperature and adjust the operating conditions accordingly.
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The recommended soldering conditions for the BYV26E are: peak temperature 260°C, soldering time 10 seconds, and a soldering iron temperature of 350°C. Use a solder with a melting point above 217°C, and ensure the device is not exposed to excessive moisture or thermal shock during the soldering process.
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Yes, the BYV26E can be used in switching regulator applications. However, ensure the device is operated within its recommended switching frequency range (up to 100 kHz) and that the output voltage is within the device's specified range. Additionally, consider the device's power dissipation and thermal management when designing the switching regulator circuit.
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To protect the BYV26E from EOS and ESD, follow proper handling and storage procedures. Use anti-static packaging and wrist straps when handling the device. Implement EOS protection circuits, such as TVS diodes or zener diodes, in the application circuit. Ensure the device is not exposed to excessive voltage or current during operation.
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BYV26E Overview
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