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- Stock & Prices $ Price & Stock for BYW51-200G
- Part Number BYW51-200G
- Manufacturer onsemi
- Pin Count 3
- Part Category Diode
- Package Category Transistor Outline, Vertical
- Footprint Name Transistor Outline, Vertical - TO-220 CASE 221A-09 ISSUE AH
- Released Date Dec 31, 2020
- Last Modified Date Jan 22, 2025 4:53 PM UTC
- Pinout / Pin List Click Here (Member Only)
BYW51-200G Details
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Manufacturer Part Number:
BYW51-200G
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Brand Name:
onsemi
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Pbfree Code:
Yes
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Part Package Code:
TO-220 3 LEAD STANDARD
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Package Description:
CASE 221A-09, 3 PIN
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Pin Count:
3
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Manufacturer Package Code:
221A
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Country Of Origin:
Vietnam
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ECCN Code:
EAR99
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HTS Code:
8541.10.00.80
BYW51-200G Frequently Asked Questions (FAQs)
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A recommended PCB layout for the BYW51-200G includes a thermal pad on the bottom of the device, connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a heat sink or a metal plate for further heat dissipation.
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To ensure proper biasing, the BYW51-200G requires a gate-source voltage (Vgs) of 10-15V, and a drain-source voltage (Vds) of 200V. The gate resistor (Rg) should be in the range of 1-10kΩ, and the drain resistor (Rd) should be in the range of 10-100Ω. Additionally, a gate-source capacitor (Cgs) of 100-1000pF is recommended to filter out high-frequency noise.
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Critical parameters to monitor during operation include the drain-source voltage (Vds), drain current (Id), and junction temperature (Tj). The device should be operated within the recommended maximum ratings, and the junction temperature should be kept below 150°C to prevent thermal damage.
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To protect the BYW51-200G from ESD, handle the device by the body or use an anti-static wrist strap. The device should be stored in an anti-static bag or wrapped in anti-static material. During assembly, use an ESD-safe workstation and ensure all tools and equipment are grounded.
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The recommended soldering conditions for the BYW51-200G include a peak temperature of 260°C, a soldering time of 10-30 seconds, and a soldering iron temperature of 350-400°C. The device should be soldered using a solder with a melting point of 180-220°C.
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BYW51-200G Overview
Use the download button to access the BYW51-200G schematic symbol, PCB footprint, and 3D model.
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