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BZA456A,125 - Nexperia

Description: BZA456A - Quadruple ESD transient voltage suppressor

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PCB Footprints
BZA456A,125 - Nexperia PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SOT 457
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3D Models
BZA456A,125 - Nexperia  - 3D model - SOT23 (6-Pin) - SOT 457
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BZA456A,125 Details

  • Manufacturer Part Number:

    BZA456A,125

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSOP

  • Package Description:

    SC-74, SOT-457, 6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    SOT457

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    5.98

  • Breakdown Voltage-Max:

    5.88 V

  • Breakdown Voltage-Min:

    5.32 V

  • Breakdown Voltage-Nom:

    5.6 V

  • Clamping Voltage-Max:

    8 V

  • Configuration:

    COMMON ANODE, 4 ELEMENTS, 4 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • Forward Voltage-Max (VF):

    1.3 V

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    24 W

  • Number of Elements:

    4

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.72 W

  • Reference Standard:

    IEC-134; IEC-1000-4-2

  • Rep Pk Reverse Voltage-Max:

    5.88 V

  • Reverse Current-Max:

    2 µA

  • Reverse Test Voltage:

    3 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

BZA456A,125 Frequently Asked Questions (FAQs)

  • Nexperia recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure the device is operated within the specified temperature range (up to 150°C). Use a heat sink or thermal interface material to maintain a safe junction temperature. Monitor the device's thermal resistance (Rth(j-a)) and adjust the design accordingly.
  • Although the datasheet doesn't specify a maximum gate voltage, Nexperia recommends keeping it within ±20V to prevent damage to the internal ESD protection diodes.
  • Yes, but be aware that the BZA456A,125 has a relatively high gate charge (Qg) and output capacitance (Coss). This may affect the device's performance at high frequencies. Ensure proper gate drive design and consider using a gate driver with a high current capability.
  • The internal ESD protection diodes are designed to protect the device from electrostatic discharge. However, they can also affect the device's performance. Ensure proper PCB layout and design to minimize parasitic inductance and capacitance, which can trigger the ESD diodes.

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BZA456A,125 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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