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BZA820A,115 - Nexperia

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BZA820A,115 Details

  • Manufacturer Part Number:

    BZA820A,115

  • Brand Name:

    Nexperia

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Package Description:

    R-PDSO-G5

  • Pin Count:

    5

  • Manufacturer Package Code:

    SOT353

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Nexperia

  • YTEOL:

    0

  • Breakdown Voltage-Max:

    21 V

  • Breakdown Voltage-Min:

    19 V

  • Breakdown Voltage-Nom:

    20 V

  • Configuration:

    COMMON ANODE, 4 ELEMENTS, 4 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Non-rep Peak Rev Power Dis-Max:

    17 W

  • Number of Elements:

    4

  • Number of Terminals:

    5

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.335 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-61000-4-2, 4-5

  • Rep Pk Reverse Voltage-Max:

    15 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Test Voltage:

    15 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

BZA820A,115 Frequently Asked Questions (FAQs)

  • NXP recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow NXP's recommended thermal design guidelines, including proper heat sinking, thermal interface materials, and PCB layout. Additionally, consider derating the device's power handling capabilities according to the temperature derating curve provided in the datasheet.
  • The BZA820A,115 has built-in ESD protection, but it's still recommended to follow standard ESD handling precautions during assembly and testing. A minimum of 2kV HBM (Human Body Model) and 200V MM (Machine Model) ESD protection is recommended for handling and assembly.
  • While the BZA820A,115 is primarily designed for linear applications, it can be used in switching applications with proper design considerations. However, the device's switching performance may not be optimized, and additional components may be required to ensure reliable operation. Consult NXP's application notes and technical support for guidance on switching applications.
  • NXP recommends following the standard soldering conditions for lead-free soldering, with a peak temperature of 260°C (500°F) and a dwell time of 30-60 seconds. Ensure that the soldering process is optimized to prevent thermal damage to the device.

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BZA820A,115 Overview

Use the download button to access the BZA820A,115 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like BZA82, or try a keyword search, such as Transient Suppressors

About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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