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BZB784-C2V4,115 - Nexperia

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BZB784-C2V4,115 Details

  • Manufacturer Part Number:

    BZB784-C2V4,115

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-70

  • Package Description:

    SC-70, SOT323, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT323

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    6.7

  • Configuration:

    COMMON ANODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    100 Ω

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    600 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.35 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-60134

  • Reference Voltage-Nom:

    2.4 V

  • Reverse Current-Max:

    50 µA

  • Reverse Test Voltage:

    1 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Temp Coeff-Max:

    -1.3 mV/°C

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    5 mA

BZB784-C2V4,115 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the BZB784-C2V4,115 is a standard SOT23 package with a minimum pad size of 0.8 mm x 0.8 mm and a maximum pad size of 1.2 mm x 1.2 mm, with a non-solder mask defined (NSMD) pad shape.
  • To ensure reliable operation in high-temperature environments, it is recommended to follow proper thermal management practices, such as providing adequate heat sinking, using a thermally conductive PCB material, and avoiding excessive power dissipation. Additionally, the device should be operated within its specified temperature range of -40°C to 150°C.
  • The maximum allowed voltage on the gate of the BZB784-C2V4,115 is 20 V, as specified in the datasheet. Exceeding this voltage may damage the device.
  • Yes, the BZB784-C2V4,115 can be used in switching applications, but it is essential to ensure that the device is operated within its specified switching frequency range and that the gate drive circuit is properly designed to minimize switching losses and prevent overheating.
  • To handle ESD protection when working with the BZB784-C2V4,115, it is recommended to follow standard ESD handling practices, such as using an ESD wrist strap, ESD mat, or ESD-safe work surface, and avoiding direct contact with the device pins.

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BZB784-C2V4,115 Overview

Use the download button to access the BZB784-C2V4,115 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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