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BZD27C200P-HE3-08 - Vishay

Description: Diode Zener Single 200V 6% 800mW Automotive 2-Pin SMF T/R

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PCB Footprints
BZD27C200P-HE3-08 - Vishay PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SMF (DO-219AB)
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BZD27C200P-HE3-08 - Vishay  - 3D model - Small Outline Diode Flat Lead - SMF (DO-219AB)
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BZD27C200P-HE3-08 Details

  • Manufacturer Part Number:

    BZD27C200P-HE3-08

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DO-219AB

  • Package Description:

    SMF, 2 PIN

  • Pin Count:

    2

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    65 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    0

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • JEDEC-95 Code:

    DO-219AB

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.8 W

  • Reference Standard:

    AEC-Q101

  • Reference Voltage-Nom:

    200 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    6%

  • Working Test Current:

    5 mA

BZD27C200P-HE3-08 Frequently Asked Questions (FAQs)

  • The recommended storage temperature for BZD27C200P-HE3-08 is -40°C to 125°C.
  • Yes, the BZD27C200P-HE3-08 is AEC-Q101 qualified, making it suitable for automotive applications.
  • The maximum power dissipation of the BZD27C200P-HE3-08 is 1.5 W.
  • Yes, the BZD27C200P-HE3-08 is designed for high-reliability applications and is built with a glass passivated chip to ensure long-term stability and reliability.
  • The typical reverse recovery time of the BZD27C200P-HE3-08 is 50 ns.

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BZD27C200P-HE3-08 Overview

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Part Image BZD27C200PRT Taiwan Semiconductor

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Part Image BZD27C200PHRT Taiwan Semiconductor

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Part Image BZD27C200PRF Taiwan Semiconductor

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For a full list of alternate parts for BZD27C200P-HE3-08, check out Findchips.com