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BZD27C30P-HE3-08 - Vishay

Description: Zener Diodes ZENER DIODE SMF DO219-HE3

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BZD27C30P-HE3-08 - Vishay PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SMF (DO-219AB)-1
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BZD27C30P-HE3-08 - Vishay  - 3D model - Small Outline Diode Flat Lead - SMF (DO-219AB)-1
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BZD27C30P-HE3-08 Details

  • Manufacturer Part Number:

    BZD27C30P-HE3-08

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DO-219AB

  • Package Description:

    SMF, 2 PIN

  • Pin Count:

    2

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    65 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    0

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • JEDEC-95 Code:

    DO-219AB

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.8 W

  • Reference Standard:

    AEC-Q101

  • Reference Voltage-Nom:

    30 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    6.67%

  • Working Test Current:

    25 mA

BZD27C30P-HE3-08 Frequently Asked Questions (FAQs)

  • The recommended storage condition is to store the devices in a dry, cool place, away from direct sunlight, and in their original packaging or anti-static bags to prevent damage from electrostatic discharge.
  • While the device is rated for operation up to 150°C, it's essential to consider the derating curves and thermal management to ensure reliable operation. Consult with a thermal expert or Vishay's application notes for guidance.
  • Follow standard SMT assembly and soldering practices, ensuring that the device is not exposed to excessive temperatures, moisture, or mechanical stress. Refer to Vishay's assembly and soldering guidelines for specific recommendations.
  • The lifespan of the device depends on various factors, including operating conditions, quality of the assembly, and environmental factors. Vishay provides reliability data and guidelines for estimating the device's lifespan in their application notes and reliability reports.
  • While the device is designed for high-reliability applications, it's essential to consult with Vishay's application engineers and follow their guidelines for using the device in safety-critical applications. Additionally, ensure that the device is properly qualified and certified for the specific application.

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BZD27C30P-HE3-08 Overview

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Image Part Number Model
Part Image BZD27C30P-E3-18 Vishay Intertechnologies

Zener Diode, 30V V(Z), 6.67%, 2.3W, Silicon, Unidirectional, DO-219AB

Part Image BZD27C30P PanJit Semiconductor

Zener Diode, 30V V(Z), 5%, 0.8W, Silicon, Unidirectional

Part Image BZD27C30P-HE3-18 Vishay Intertechnologies

Zener Diode, 30V V(Z), 6.67%, 0.8W, Silicon, Unidirectional, DO-219AB

Part Image BZD27C30P-M-18 Vishay Intertechnologies

Zener Diode, 30V V(Z), 6.67%, 0.8W, Silicon, Unidirectional, DO-219AB

Part Image BZD27C30P_R1_00001 PanJit Semiconductor

Zener Diode, 30V V(Z), 5%, 1W, Silicon, Unidirectional

For a full list of alternate parts for BZD27C30P-HE3-08, check out Findchips.com