HALOGEN FREE AND ROHS COMPLIANT, HERMETIC SEALED, GLASS PACKAGE-2
ECCN Code:
EAR99
HTS Code:
8541.10.00.50
Factory Lead Time:
12 Weeks
Manufacturer:
Vishay Intertechnologies
YTEOL:
5.5
Breakdown Voltage-Max:
106 V
Breakdown Voltage-Min:
94 V
Case Connection:
ISOLATED
Configuration:
SINGLE
Diode Element Material:
SILICON
Diode Type:
TRANS VOLTAGE SUPPRESSOR DIODE
Dynamic Impedance-Max:
200 Ω
JESD-30 Code:
E-LALF-W2
JESD-609 Code:
e2
Moisture Sensitivity Level:
1
Non-rep Peak Rev Power Dis-Max:
600 W
Number of Elements:
1
Number of Terminals:
2
Operating Temperature-Max:
175 °C
Package Body Material:
GLASS
Package Shape:
ELLIPTICAL
Package Style:
LONG FORM
Peak Reflow Temperature (Cel):
260
Polarity:
UNIDIRECTIONAL
Power Dissipation-Max:
1.3 W
Qualification Status:
Not Qualified
Reference Voltage-Nom:
100 V
Rep Pk Reverse Voltage-Max:
82 V
Surface Mount:
NO
Technology:
ZENER
Terminal Finish:
Tin/Silver (Sn96.5Ag3.5)
Terminal Form:
WIRE
Terminal Position:
AXIAL
Time@Peak Reflow Temperature-Max (s):
30
Voltage Tol-Max:
6%
BZT03C100-TR Frequently Asked Questions (FAQs)
The recommended storage condition for BZT03C100-TR is in a dry, cool place, away from direct sunlight and moisture. The storage temperature should be between -40°C to 125°C.
To prevent electrostatic discharge (ESD) damage, handle BZT03C100-TR components with an anti-static wrist strap or mat, and ensure that the workspace is ESD-protected.
The maximum allowable voltage derating for BZT03C100-TR is 10% of the rated voltage, but it's recommended to follow the derating curve provided in the datasheet to ensure safe operation.
While BZT03C100-TR is suitable for high-frequency applications, its performance may degrade above 1 MHz. It's recommended to consult with a Vishay application engineer or perform thorough testing to ensure suitability for high-frequency use.
Use a soldering iron with a temperature of 250°C to 260°C, and ensure the soldering time is less than 3 seconds. Avoid applying excessive force or bending the leads during soldering.
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BZT03C100-TR Overview
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