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BZT52C11LP-7 - Diodes Incorporated

Description: Zener Diode 11 V 250 mW ±6% Surface Mount X1-DFN1006-2

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BZT52C11LP-7 - Diodes Incorporated PCB footprint - Other - Other - X1-DFN1006-2_2025-8
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BZT52C11LP-7 Details

  • Manufacturer Part Number:

    BZT52C11LP-7

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    7.37

  • Additional Feature:

    HIGH RELIABILITY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    20 Ω

  • JESD-30 Code:

    R-PBCC-N2

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.25 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    11 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    5.45%

  • Working Test Current:

    5 mA

BZT52C11LP-7 Frequently Asked Questions (FAQs)

  • The recommended land pattern for BZT52C11LP-7 can be found in the Diodes Incorporated's SOT23 package layout guidelines, which provides a suggested PCB footprint and pad layout for optimal assembly and reliability.
  • While the BZT52C11LP-7 is rated for operation up to 150°C, it's essential to consider the derating curves and thermal management in your design to ensure reliable operation. Consult with Diodes Incorporated's application notes and thermal design guidelines for more information.
  • To prevent electrostatic discharge (ESD) damage, follow proper handling and storage procedures, such as using ESD-safe workstations, wrist straps, and packaging materials. Additionally, consider incorporating ESD protection devices or circuits in your design to protect the BZT52C11LP-7 and other sensitive components.
  • The lead time and minimum order quantity (MOQ) for BZT52C11LP-7 may vary depending on the region, distributor, and availability. It's best to check with authorized distributors or Diodes Incorporated's sales representatives for the most up-to-date information and to plan your production accordingly.
  • While there may be similar parts from other manufacturers, it's essential to verify the specifications, performance, and compatibility before substituting the BZT52C11LP-7. Consult with Diodes Incorporated's cross-reference guide or contact their technical support for assistance in finding a suitable replacement.

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BZT52C11LP-7 Overview

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