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BZT52C5V1LP-7 - Diodes Incorporated

Description: Zener Diode 5.1 V 250 mW ±6% Surface Mount X1-DFN1006-2

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BZT52C5V1LP-7 - Diodes Incorporated PCB footprint - Other - Other - BZT52C5V1LP-7-6
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BZT52C5V1LP-7 - Diodes Incorporated  - 3D model - Other - BZT52C5V1LP-7-6
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BZT52C5V1LP-7 Details

  • Manufacturer Part Number:

    BZT52C5V1LP-7

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    7

  • Additional Feature:

    HIGH RELIABILITY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    60 Ω

  • JESD-30 Code:

    R-PBCC-N2

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.25 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    5.1 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    5.88%

  • Working Test Current:

    5 mA

BZT52C5V1LP-7 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the BZT52C5V1LP-7 can be found in the Diodes Incorporated's package outline drawing, which is available on their website. It's essential to follow the recommended land pattern to ensure reliable soldering and to prevent thermal and electrical issues.
  • To prevent ESD damage, it's recommended to handle the BZT52C5V1LP-7 in an ESD-controlled environment, wear an ESD strap, and use ESD-safe tools and materials. Additionally, the device should be stored in its original packaging or in an ESD-safe container when not in use.
  • The maximum allowable voltage derating for the BZT52C5V1LP-7 is typically 80% of the rated voltage. However, it's recommended to consult with the manufacturer or a qualified engineer to determine the appropriate derating factor for a specific application.
  • The BZT52C5V1LP-7 is rated for operation up to 150°C. However, it's essential to consider the device's power dissipation, thermal resistance, and other thermal characteristics to ensure reliable operation in high-temperature environments.
  • The reliability and MTBF (Mean Time Between Failures) of the BZT52C5V1LP-7 can be determined using various methods, including MIL-HDBK-217, Telcordia, and Chi-Square calculations. It's recommended to consult with the manufacturer or a qualified reliability engineer to determine the MTBF for a specific application.

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BZT52C5V1LP-7 Overview

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