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BZT52C6V2LP-7 - Diodes Incorporated

Description: Diodes Inc BZT52C6V2LP-7 Zener Diode, 6.2V 6% 250 mW SMT 2-Pin DFN-1006

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Symbol
BZT52C6V2LP-7 - Diodes Incorporated - PCB symbol
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PCB Footprints
BZT52C6V2LP-7 - Diodes Incorporated PCB footprint - Other - Other - X1-DFN1006-2
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3D Models
BZT52C6V2LP-7 - Diodes Incorporated - 3D model - Other - X1-DFN1006-2
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BZT52C6V2LP-7 Details

  • Manufacturer Part Number:

    BZT52C6V2LP-7

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    7

  • Additional Feature:

    HIGH RELIABILITY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    10 Ω

  • JESD-30 Code:

    R-PBCC-N2

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.25 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    6.2 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Voltage Tol-Max:

    6.45%

  • Working Test Current:

    5 mA

BZT52C6V2LP-7 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the BZT52C6V2LP-7 can be found in the Diodes Incorporated's package outline drawing, which is available on their website. It's essential to follow the recommended land pattern to ensure reliable soldering and to prevent thermal issues.
  • To prevent ESD damage, it's recommended to handle the BZT52C6V2LP-7 in an ESD-protected environment, use ESD-safe tools and equipment, and ensure that all personnel handling the device are grounded. It's also essential to follow proper assembly and soldering procedures to prevent damage during the assembly process.
  • The maximum allowable power dissipation for the BZT52C6V2LP-7 depends on the operating conditions, such as ambient temperature and thermal resistance. The datasheet provides a power derating curve that can be used to determine the maximum allowable power dissipation under specific operating conditions.
  • The BZT52C6V2LP-7 is a commercial-grade device, and its reliability may not be suitable for high-reliability applications. However, Diodes Incorporated may offer a high-reliability version of the device or a similar device that meets the requirements of high-reliability applications. It's recommended to contact Diodes Incorporated directly to discuss specific requirements.
  • The junction temperature of the BZT52C6V2LP-7 can be determined using the thermal resistance values provided in the datasheet and the power dissipation of the device. The thermal resistance values can be used to calculate the junction temperature rise above the ambient temperature, and then the junction temperature can be calculated using the ambient temperature.

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BZT52C6V2LP-7 Overview

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