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BZT52C8V2S-TP - MCC

Description: Planar Die Construction • Ideally Suited for Automated Assembly Processes • General Purpose Medium Current • Halogen Free. “Green” Device (Note 1) • Moisture Sensitivity Level 1 • Epoxy Meets UL 94 V-0 Flammability Rating • Lead Free Finish/RoHS Compliant t ("P" Suffix Designates RoHS Compliant. See Ordering Information)

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BZT52C8V2S-TP - MCC - PCB symbol
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BZT52C8V2S-TP - MCC PCB footprint - Small Outline Diode - Small Outline Diode - SOD-323_2023
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BZT52C8V2S-TP - MCC - 3D model - Small Outline Diode - SOD-323_2023
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BZT52C8V2S-TP Details

  • Manufacturer Part Number:

    BZT52C8V2S-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    PLASTIC PACKAGE-2

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    7.1

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    15 Ω

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    80 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.2 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    8.2 V

  • Reverse Current-Max:

    0.7 µA

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Voltage Tol-Max:

    6.1%

  • Working Test Current:

    5 mA

BZT52C8V2S-TP Frequently Asked Questions (FAQs)

  • The recommended land pattern for BZT52C8V2S-TP can be found in the Micro Commercial Components' application note or on their website. It typically includes a rectangular pad with a size of around 0.5mm x 0.5mm, with a solder mask clearance of 0.1mm.
  • To handle the ESD sensitivity of BZT52C8V2S-TP, it is recommended to follow proper ESD handling procedures, such as using an ESD wrist strap or mat, and storing the components in an ESD-safe environment. Additionally, the device should be handled by the body or leads, rather than the glass diode, to prevent damage.
  • The maximum surge current that BZT52C8V2S-TP can withstand is typically specified in the datasheet as 30A for a 10/1000μs waveform. However, it's recommended to consult the datasheet or contact Micro Commercial Components for specific information on surge current capability.
  • BZT52C8V2S-TP is rated for operation up to 150°C, but its performance may degrade at high temperatures. It's recommended to consult the datasheet or contact Micro Commercial Components for specific information on high-temperature operation and any necessary derating.
  • To ensure the reliability of BZT52C8V2S-TP, it's recommended to follow proper design and manufacturing practices, such as using a robust PCB design, ensuring proper soldering and assembly, and performing thorough testing and inspection. Additionally, it's recommended to consult the datasheet and application notes for specific guidance on reliability.

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BZT52C8V2S-TP Overview

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