- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for BZW06-31B
- Part Number BZW06-31B
- Manufacturer Diotec
- Pin Count 2
- Part Category TVS Diode (Bi-directional)
- Package Category Diodes, Axial Diameter Horizontal Mounting
- Footprint Name Diodes, Axial Diameter Horizontal Mounting - BZW06-31B*
- Released Date May 15, 2023
- Last Modified Date May 16, 2023 6:25 AM UTC
- Pinout / Pin List Click Here (Member Only)
BZW06-31B Details
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Manufacturer Part Number:
BZW06-31B
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Part Package Code:
DO-15
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Pin Count:
2
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Country Of Origin:
Mainland China
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ECCN Code:
EAR99
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HTS Code:
8541.10.00.50
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Manufacturer:
Diotec Semiconductor AG
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YTEOL:
6
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Breakdown Voltage-Max:
37.8 V
BZW06-31B Frequently Asked Questions (FAQs)
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A recommended PCB layout for optimal thermal performance would be to use a large copper area for the tab connection, and to ensure good thermal conduction to the surrounding copper layers. A thermal via array can also be used to improve heat dissipation.
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To ensure reliability in high-temperature applications, it's essential to follow the recommended derating curves, ensure proper heat sinking, and avoid exceeding the maximum junction temperature (Tj) of 150°C. Additionally, consider using a thermally conductive interface material and a robust PCB design.
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The BZW06-31B has an internal ESD protection diode, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Additionally, consider adding external ESD protection devices, such as TVS diodes, to protect the device from external ESD events.
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While the BZW06-31B is primarily designed for low-frequency applications, it can be used in high-frequency applications up to a few hundred kHz. However, it's essential to consider the device's parasitic capacitance and inductance, and to ensure proper PCB layout and decoupling to minimize high-frequency losses.
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The recommended soldering conditions for the BZW06-31B are a peak temperature of 260°C, a soldering time of 10 seconds, and a temperature profile that follows the IPC-J-STD-020D standard. It's also recommended to use a solder with a high melting point and a flux that is compatible with the device's package.
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BZW06-31B Overview
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