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BZX384-B43,115 - Nexperia

Description: Zener Diodes 300MW 43V

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PCB Footprints
BZX384-B43,115 - Nexperia PCB footprint - Small Outline Diode - Small Outline Diode - SOD323 (SC-76),2021
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3D Models
BZX384-B43,115 - Nexperia  - 3D model - Small Outline Diode - SOD323 (SC-76),2021
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BZX384-B43,115 Details

  • Manufacturer Part Number:

    BZX384-B43,115

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD

  • Package Description:

    PLASTIC, SC-76, SOD-323, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SOD323

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    7

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    150 Ω

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    375 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.3 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-60134

  • Reference Voltage-Nom:

    43 V

  • Reverse Current-Max:

    0.05 µA

  • Reverse Test Voltage:

    30.1 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Temp Coeff-Max:

    46.6 mV/°C

  • Voltage Tol-Max:

    2%

  • Working Test Current:

    2 mA

BZX384-B43,115 Frequently Asked Questions (FAQs)

  • The recommended land pattern for BZX384-B43,115 is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a solder mask opening of 0.5 mm x 0.5 mm.
  • To handle thermal considerations, ensure a good thermal connection to a copper plane or a thermal pad on the PCB. A thermal via or a thermal pad with a diameter of at least 1 mm is recommended.
  • The maximum permissible voltage for BZX384-B43,115 is 43 V, as specified in the datasheet. Exceeding this voltage may damage the device.
  • BZX384-B43,115 is rated for operation up to 150°C. However, the device's performance and reliability may degrade at high temperatures. Consult the datasheet and application notes for specific guidance.
  • To ensure reliability in a humid environment, follow proper PCB design and assembly guidelines, including using a moisture-resistant coating and conformal coating. Also, ensure the device is stored in a dry environment before assembly.

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BZX384-B43,115 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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