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BZX384-C12 - Nexperia

Description: NXP BZX384-C12 Zener Diode, 12V 5% 0.3 W SMT 2-Pin UMD

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PCB Footprints
BZX384-C12 - Nexperia PCB footprint - Small Outline Diode - Small Outline Diode - SOD323 (SC-76)
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3D Models
BZX384-C12 - Nexperia  - 3D model - Small Outline Diode - SOD323 (SC-76)
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BZX384-C12 Details

  • Manufacturer Part Number:

    BZX384-C12

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOD-323, 2 PIN

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Date Of Intro:

    2017-02-01

  • Manufacturer:

    Nexperia

  • YTEOL:

    7

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    25 Ω

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    150 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.3 W

  • Reference Standard:

    IEC-60134

  • Reference Voltage-Nom:

    12 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Test Voltage:

    8 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Temp Coeff-Max:

    10 mV/°C

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    5 mA

BZX384-C12 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the BZX384-C12 can be found in the Nexperia's SOD323 package outline drawing, which is available on the Nexperia website. The land pattern should ensure a good solder joint and minimize thermal resistance.
  • The BZX384-C12 is an ESD-sensitive device. To prevent damage, handle the device with an ESD wrist strap or mat, and ensure that the assembly line and storage areas are ESD-protected. Follow the guidelines in the ANSI/ESD S20.20 standard for ESD control.
  • The maximum power dissipation of the BZX384-C12 is dependent on the ambient temperature and the thermal resistance of the device. According to the datasheet, the maximum power dissipation is 250 mW at an ambient temperature of 25°C. However, this value can be derated at higher temperatures.
  • Yes, the BZX384-C12 is suitable for high-reliability applications. Nexperia provides a range of reliability data, including FIT rates and MTBF values, which can be used to assess the device's suitability for specific applications.
  • The correct voltage rating for your application depends on the maximum voltage that the device will be exposed to. The BZX384-C12 has a voltage rating of 12 V, which means it can withstand a maximum voltage of 12 V. Ensure that the device is not exposed to voltages exceeding this rating to prevent damage or failure.

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BZX384-C12 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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