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BZX384B12-G3-08 - Vishay

Description: Zener Diodes 12 Volt 0.2W 2%

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BZX384B12-G3-08 - Vishay PCB footprint - Small Outline Diode - Small Outline Diode - BZX384B12-G3-08-
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BZX384B12-G3-08 Details

  • Manufacturer Part Number:

    BZX384B12-G3-08

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOD-323, 2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    7.1

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    25 Ω

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    150 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.2 W

  • Reference Voltage-Nom:

    12 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Test Voltage:

    8 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    2%

  • Working Test Current:

    5 mA

BZX384B12-G3-08 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the BZX384B12-G3-08 can be found in the Vishay Intertechnologies' application note AN10365, which provides guidelines for surface-mount assembly of diodes and rectifiers.
  • To prevent damage during soldering, it is recommended to follow the soldering profile recommended in the datasheet, and to use a soldering iron with a temperature of 260°C (500°F) or less. Additionally, the component should be soldered within 10 seconds to prevent overheating.
  • The ESR of the BZX384B12-G3-08 is not explicitly stated in the datasheet, but it can be estimated to be around 1-2 ohms based on the device's internal construction and similar devices in the same family.
  • The BZX384B12-G3-08 is a general-purpose zener diode and is not optimized for high-frequency applications. It may not perform well above 100 kHz, and alternative devices such as the Vishay VZ series may be more suitable for high-frequency applications.
  • The MSL of the BZX384B12-G3-08 is MSL 1, which means it can be exposed to a maximum of 30°C/85% RH for 168 hours without being damaged.

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BZX384B12-G3-08 Overview

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