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BZX55C12-TAP - Vishay

Description: Diode Zener Single 500mW 12V DO-35 Vishay BZX55C12-TAP Zener Diode, 12V 5% 0.5 W Through Hole 2-Pin DO-35

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PCB Footprints
BZX55C12-TAP - Vishay PCB footprint - Diodes, Axial Diameter Horizontal Mounting - Diodes, Axial Diameter Horizontal Mounting - DO-35-ren3
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3D Models
BZX55C12-TAP - Vishay  - 3D model - Diodes, Axial Diameter Horizontal Mounting - DO-35-ren3
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BZX55C12-TAP Details

  • Manufacturer Part Number:

    BZX55C12-TAP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HALOGEN FREE AND ROHS COMPLIANT, PLASTIC PACKAGE-2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6

  • Additional Feature:

    LOW NOISE

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    20 Ω

  • JEDEC-95 Code:

    DO-35

  • JESD-30 Code:

    O-PALF-W2

  • JESD-609 Code:

    e2

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    ROUND

  • Package Style:

    LONG FORM

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.5 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    AEC-Q101

  • Reference Voltage-Nom:

    12 V

  • Surface Mount:

    NO

  • Technology:

    ZENER

  • Terminal Finish:

    Tin/Silver (Sn96.5Ag3.5)

  • Terminal Form:

    WIRE

  • Terminal Position:

    AXIAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    5.39%

  • Working Test Current:

    5 mA

BZX55C12-TAP Frequently Asked Questions (FAQs)

  • The recommended land pattern for the BZX55C12-TAP is a rectangular pad with a minimum size of 1.5 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape.
  • The BZX55C12-TAP has a thermal resistance of 10°C/W. To handle thermal considerations, ensure good thermal conduction by using a thermal pad or a heat sink, and avoid overheating the device.
  • The maximum allowable voltage for the BZX55C12-TAP is 12.4 V, which is the maximum working voltage. Do not exceed this voltage to avoid device damage.
  • The BZX55C12-TAP is suitable for high-frequency applications up to 1 GHz. However, ensure that the device is properly decoupled and that the PCB layout is optimized for high-frequency operation.
  • To ensure reliability in a harsh environment, follow proper storage and handling procedures, and ensure that the device is operated within its recommended operating conditions. Also, consider using a conformal coating to protect the device from moisture and contaminants.

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BZX55C12-TAP Overview

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