HALOGEN FREE AND ROHS COMPLIANT, PLASTIC PACKAGE-2
Country Of Origin:
Mainland China
ECCN Code:
EAR99
HTS Code:
8541.10.00.50
Factory Lead Time:
9 Weeks
Manufacturer:
Vishay Intertechnologies
YTEOL:
5.93
Additional Feature:
LOW NOISE
Case Connection:
ISOLATED
Configuration:
SINGLE
Diode Element Material:
SILICON
Diode Type:
ZENER DIODE
Dynamic Impedance-Max:
50 Ω
JEDEC-95 Code:
DO-35
JESD-30 Code:
O-PALF-W2
JESD-609 Code:
e2
Moisture Sensitivity Level:
1
Number of Elements:
1
Number of Terminals:
2
Operating Temperature-Max:
175 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
ROUND
Package Style:
LONG FORM
Peak Reflow Temperature (Cel):
260
Polarity:
UNIDIRECTIONAL
Power Dissipation-Max:
0.5 W
Qualification Status:
Not Qualified
Reference Standard:
AEC-Q101
Reference Voltage-Nom:
18 V
Surface Mount:
NO
Technology:
ZENER
Terminal Finish:
Tin/Silver (Sn96.5Ag3.5)
Terminal Form:
WIRE
Terminal Position:
AXIAL
Time@Peak Reflow Temperature-Max (s):
30
Voltage Tol-Max:
6.41%
Working Test Current:
5 mA
BZX55C18-TR Frequently Asked Questions (FAQs)
The recommended land pattern for the BZX55C18-TR is a rectangular pad with a minimum size of 1.3 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape.
The BZX55C18-TR has a thermal resistance of 10°C/W. To handle thermal considerations, ensure good thermal conduction by using a thermal pad or a heat sink, and avoid overheating the device.
The maximum allowable voltage derating for the BZX55C18-TR is 10% of the rated voltage, which is 16.2V for this device.
The BZX55C18-TR is suitable for high-frequency applications up to 1 GHz. However, it's essential to consider the device's impedance and parasitic capacitance when designing the circuit.
To ensure the BZX55C18-TR's reliability, follow proper storage and handling procedures, use a clean and dry environment, and avoid exceeding the device's absolute maximum ratings.
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BZX55C18-TR Overview
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