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BZX585-B2V7,115 - Nexperia

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BZX585-B2V7,115 - Nexperia  - 3D model
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BZX585-B2V7,115 Details

  • Manufacturer Part Number:

    BZX585-B2V7,115

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD

  • Pin Count:

    2

  • Manufacturer Package Code:

    SOD523

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    6.95

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    100 Ω

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    450 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.3 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-60134

  • Reference Voltage-Nom:

    2.7 V

  • Reverse Current-Max:

    20 µA

  • Reverse Test Voltage:

    1 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    TIN

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    2%

  • Working Test Current:

    5 mA

BZX585-B2V7,115 Frequently Asked Questions (FAQs)

  • The recommended land pattern for BZX585-B2V7,115 is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a solder mask opening of 0.5 mm x 0.5 mm.
  • To handle thermal considerations, ensure a good thermal connection to a copper plane or a thermal pad on the PCB. A thermal via or a thermal pad with a diameter of at least 1 mm is recommended.
  • The maximum allowable power dissipation for BZX585-B2V7,115 is 250 mW. However, this value can be derated based on the ambient temperature and the thermal resistance of the PCB.
  • Yes, BZX585-B2V7,115 is suitable for high-reliability applications. It is manufactured using a high-reliability process and is qualified according to AEC-Q101.
  • To ensure the reliability of the solder joints, follow the recommended soldering profile and use a solder with a melting point above 217°C. Also, ensure that the PCB is designed with a sufficient solder mask opening and a suitable land pattern.

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BZX585-B2V7,115 Overview

Use the download button to access the BZX585-B2V7,115 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like BZX58, or try a keyword search, such as Zener Diodes

About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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For a full list of alternate parts for BZX585-B2V7,115, check out Findchips.com