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BZX84C12VLYFHT116 - ROHM Semiconductor

Description: 250mW, 12V, SOT-23, Automotive Zener Diode (BZX84C series)

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BZX84C12VLYFHT116 - ROHM Semiconductor PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23 SSD3
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BZX84C12VLYFHT116 - ROHM Semiconductor  - 3D model - SOT23 (3-Pin) - SOT-23 SSD3
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BZX84C12VLYFHT116 Details

  • Manufacturer Part Number:

    BZX84C12VLYFHT116

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOT-23, 3 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    7.1

  • Additional Feature:

    HIGH RELIABILITY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    25 Ω

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR, 7 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.25 W

  • Reference Standard:

    AEC-Q101

  • Reference Voltage-Nom:

    12 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Test Voltage:

    8 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Temp Coeff-Max:

    9.8 mV/°C

  • Voltage Tol-Max:

    5.39%

  • Working Test Current:

    5 mA

BZX84C12VLYFHT116 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the BZX84C12VLYFHT116 can be found in the ROHM Semiconductor's package drawing document, which is usually available on their website. The document provides detailed information on the recommended pad layout, dimensions, and spacing for optimal assembly and reliability.
  • To handle the ESD sensitivity of the BZX84C12VLYFHT116, it is recommended to follow proper ESD handling procedures during assembly, storage, and shipping. This includes using ESD-safe materials, grounding personnel and equipment, and using protective packaging. Additionally, consider adding ESD protection devices or circuits in the design to prevent damage from electrostatic discharge.
  • The maximum allowable power dissipation for the BZX84C12VLYFHT116 can be calculated using the thermal resistance and maximum junction temperature ratings provided in the datasheet. Typically, the maximum power dissipation is around 500mW to 1W, depending on the operating conditions and ambient temperature. However, it's recommended to consult the datasheet and perform thermal analysis to determine the safe operating power range for the specific application.
  • The BZX84C12VLYFHT116 is a commercial-grade device, and its suitability for high-reliability or automotive applications depends on the specific requirements and standards of the application. ROHM Semiconductor may offer automotive-grade or high-reliability versions of the device, which would need to be specifically selected and qualified for the intended use. It's recommended to consult with ROHM Semiconductor or a qualified distributor to determine the appropriate device for the application.
  • To ensure the authenticity of the BZX84C12VLYFHT116, it's recommended to purchase from authorized distributors or directly from ROHM Semiconductor. Look for the original packaging, labeling, and documentation, and verify the device markings and packaging against the datasheet and ROHM Semiconductor's website. Be cautious of extremely low prices, and avoid purchasing from unknown or unverified sources.

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