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BZX84C13-TP - MCC

Description: Planar Die Construction • Zener Voltages from 2.4V - 75V • Ideally Suited for Automated Assembly Processes • Halogen Free. "Green" Device (Note 1) • Moisture Sensitivity Level 1 • Epoxy Meets UL 94 V-0 Flammability Rating • Lead Free Finish/RoHS Compliant ("P" Suffix Designates RoHS Compliant. See Ordering Information)

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BZX84C13-TP - MCC - PCB symbol
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PCB Footprints
BZX84C13-TP - MCC PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23-ren20
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3D Models
BZX84C13-TP - MCC - 3D model - SOT23 (3-Pin) - SOT-23-ren20
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BZX84C13-TP Details

  • Manufacturer Part Number:

    BZX84C13-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    PACKAGE-3

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6.7

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    30 Ω

  • Forward Voltage-Max (VF):

    0.9 V

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    170 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.35 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    13 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Test Voltage:

    8 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    5 mA

BZX84C13-TP Frequently Asked Questions (FAQs)

  • The recommended land pattern for the BZX84C13-TP is a rectangular pad with a size of 0.8mm x 1.2mm, with a solder mask clearance of 0.1mm. This ensures proper soldering and minimizes the risk of solder bridging.
  • While the BZX84C13-TP has a maximum operating temperature of 150°C, it's not recommended to use it in high-temperature environments above 125°C for extended periods. This is because the device's reliability and performance may degrade over time.
  • To prevent ESD damage, handle the BZX84C13-TP with anti-static wrist straps, mats, or bags. Ensure that the assembly line and storage areas are ESD-protected, and use ESD-safe tools and equipment.
  • Store the BZX84C13-TP in a dry, cool place with a temperature range of 5°C to 30°C and relative humidity below 60%. Avoid storing the devices in direct sunlight or near sources of moisture.
  • While the BZX84C13-TP is designed to withstand normal vibration levels, it's not recommended to use it in extremely high-vibration environments (e.g., >10G) without proper mechanical support and fixation. This may cause the device to malfunction or fail prematurely.

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BZX84C13-TP Overview

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