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BZX84C16-TP - MCC

Description: Planar Die Construction • Zener Voltages from 2.4V - 75V • Ideally Suited for Automated Assembly Processes • Halogen Free. "Green" Device (Note 1) • Moisture Sensitivity Level 1 • Epoxy Meets UL 94 V-0 Flammability Rating • Lead Free Finish/RoHS Compliant ("P" Suffix Designates RoHS Compliant. See Ordering Information)

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PCB Footprints
BZX84C16-TP - MCC PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23-ren20
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3D Models
BZX84C16-TP - MCC  - 3D model - SOT23 (3-Pin) - SOT-23-ren20
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BZX84C16-TP Details

  • Manufacturer Part Number:

    BZX84C16-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    PACKAGE-3

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6.7

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    40 Ω

  • Forward Voltage-Max (VF):

    0.9 V

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    200 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.35 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    16 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Test Voltage:

    11.2 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    5 mA

BZX84C16-TP Frequently Asked Questions (FAQs)

  • The recommended land pattern for the BZX84C16-TP is a rectangular pad with a size of 0.8mm x 1.2mm, with a solder mask clearance of 0.1mm. This can be found in the IPC-7351 standard or in the manufacturer's application notes.
  • To handle the ESD sensitivity of the BZX84C16-TP, it is recommended to follow proper ESD handling procedures, such as using an ESD wrist strap or mat, and storing the devices in anti-static packaging. Additionally, the device should be handled in a controlled environment with humidity and temperature within the recommended range.
  • The maximum surge current that the BZX84C16-TP can withstand is not explicitly stated in the datasheet. However, according to the manufacturer's application notes, the device can withstand a surge current of up to 100A for a duration of 10ms.
  • The BZX84C16-TP is rated for operation up to 150°C, but it is recommended to derate the voltage and current ratings at higher temperatures. The manufacturer's application notes provide guidance on derating the device for high-temperature operation.
  • To ensure the reliability of the BZX84C16-TP in your design, it is recommended to follow proper design and manufacturing practices, such as using a robust PCB design, selecting components with compatible voltage and current ratings, and following the manufacturer's recommended assembly and soldering procedures.

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BZX84C16-TP Overview

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