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BZX84C20-TP - MCC

Description: Zener Diode 20 V 350 mW ±5% Surface Mount SOT-23

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Symbol
BZX84C20-TP - MCC - PCB symbol
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PCB Footprints
BZX84C20-TP - MCC PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23-ren20
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3D Models
BZX84C20-TP - MCC - 3D model - SOT23 (3-Pin) - SOT-23-ren20
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BZX84C20-TP Details

  • Manufacturer Part Number:

    BZX84C20-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    PACKAGE-3

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6.7

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    55 Ω

  • Forward Voltage-Max (VF):

    0.9 V

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    225 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.35 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    20 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Test Voltage:

    14 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    5 mA

BZX84C20-TP Frequently Asked Questions (FAQs)

  • The recommended land pattern for the BZX84C20-TP is a rectangular pad with a size of 0.8mm x 1.2mm, with a solder mask clearance of 0.1mm. This ensures proper soldering and minimizes the risk of solder bridging.
  • While the BZX84C20-TP has a maximum operating temperature of 150°C, it's not recommended to use it in high-temperature environments above 125°C for extended periods. This is because the device's reliability and performance may degrade over time.
  • To handle the BZX84C20-TP's ESD sensitivity, it's recommended to follow proper ESD handling procedures, such as using an ESD wrist strap, ESD mat, or ESD bag. Additionally, ensure that the device is stored in a dry, non-conductive environment.
  • The typical lead time for the BZX84C20-TP varies depending on the supplier and the quantity ordered. However, it's usually around 4-6 weeks for standard orders. It's recommended to check with the supplier for the most up-to-date lead time information.
  • The BZX84C20-TP is designed to withstand moderate vibration levels. However, it's recommended to ensure that the device is properly secured to the PCB and that the PCB is designed to withstand the expected vibration levels.

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BZX84C20-TP Overview

Use the download button to access the BZX84C20-TP schematic symbol, PCB footprint, and 3D model.
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