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BZX84C3V3LT1G - onsemi

Description: 250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB

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Symbol
BZX84C3V3LT1G - onsemi - PCB symbol
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PCB Footprints
BZX84C3V3LT1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08
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3D Models
BZX84C3V3LT1G - onsemi - 3D model - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08
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BZX84C3V3LT1G Details

  • Manufacturer Part Number:

    BZX84C3V3LT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    onsemi

  • YTEOL:

    7.1

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    95 Ω

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.25 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Reference Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    6.06%

  • Working Test Current:

    5 mA

BZX84C3V3LT1G Frequently Asked Questions (FAQs)

  • The recommended land pattern for the BZX84C3V3LT1G is a rectangular pad with a size of 0.6 mm x 0.3 mm, with a solder mask clearance of 0.1 mm. The pad should be centered on the component and have a non-solder mask defined (NSMD) pad shape.
  • The BZX84C3V3LT1G is an ESD-sensitive device. To handle ESD sensitivity, it is recommended to use an ESD wrist strap or mat, and to handle the device by the body or leads, avoiding touching the pins. It is also recommended to use ESD-protected equipment and to follow proper ESD handling procedures.
  • The maximum power dissipation of the BZX84C3V3LT1G is 250 mW. However, the actual power dissipation may vary depending on the operating conditions and the thermal resistance of the device. It is recommended to check the thermal resistance and power dissipation calculations to ensure the device operates within the safe operating area.
  • The BZX84C3V3LT1G is rated for operation up to 150°C. However, the device's performance and reliability may degrade at high temperatures. It is recommended to check the device's specifications and derate the power dissipation accordingly to ensure reliable operation in high-temperature environments.
  • To ensure proper soldering of the BZX84C3V3LT1G, it is recommended to use a soldering iron with a temperature of 250°C to 260°C, and to apply a small amount of solder paste to the pads. The component should be placed on the PCB with the correct orientation and the solder should be reflowed according to the recommended soldering profile.

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BZX84C3V3LT1G Overview

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